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Engineering
Capabilities and Services
PCB Assembly

PCBA

 

 HTS PCBA capabilities include:

                              Skilled FMEA ability and rich experience database
  Screen Printing Inspection
  Rapid turnaround prototyping
  High mix, Low/Medium volume build
  Surface Mount Technology - Process capability for 01005 chips and 0.2mm pitch Ball Grid Array (BGA)
  Through-hole assembly
  Special processes (such as conformal coating and potting)
  ROHS capability
  Workmanship to IPC-A-610
   

Test solutions capabilities include:

  Automatic Optical Inspection
  Reliability test (burn in, high and low temperature and humidity test)
  Analogue and Digital functional test
  PC based tester development
  Firmware programming
  Functional verification at board, semi-finished goods and system level
  Fulfillment to end customer or final destinations
   


                 

             

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