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Capabilities and Services
PCB Assembly



 HTS PCBA capabilities include:

                              Skilled FMEA ability and rich experience database
  Screen Printing Inspection
  Rapid turnaround prototyping
  High mix, Low/Medium volume build
  Surface Mount Technology - Process capability for 01005 chips and 0.2mm pitch Ball Grid Array (BGA)
  Through-hole assembly
  Special processes (such as conformal coating and potting)
  ROHS capability
  Workmanship to IPC-A-610

Test solutions capabilities include:

  Automatic Optical Inspection
  Reliability test (burn in, high and low temperature and humidity test, thermal shock)
  Analogue and Digital functional test
  PC based tester development
  Firmware programming
  Functional verification at board, semi-finished goods and system level
  Fulfillment to end customer or final destinations




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